# Xinming Shares Spatial Intelligence Chip and 3D Vision AI Module Solution at ROSCon China 2026

- Source: 古月居 · 微信公众号
- Published: 2026-10-21T09:20:00.000Z
- RoboHot: https://robohot.news/en/items/sn8hplsefaunatj6rsbfrklw1
- Original: https://mp.weixin.qq.com/s?__biz=MzU1NjEwMTY0Mw==&mid=2247622303&idx=2&sn=7ecc3957da1413858adaa6390f40c8e9&chksm=fa825410c0a205ceacea9cfbfd9798d3af01d58a94ab41d3f8d5d9d0b55fb9f027980ca19d02&scene=126&sessionid=1792575174#rd

## Summary

Xinming gave a keynote at ROSCon China 2026, where Vice President Dr. Zhou Fan presented its spatial intelligence chip and 3D vision AI module. The self-developed chip integrates real-time 3D stereo vision perception, on-device AI, and SLAM on a single chip, delivering about 3.5 TOPS of on-device compute at under 1 W power consumption, with roughly 1 ms motion-to-display latency, and supports 6 cameras and multi-sensor fusion.