Bringing AI into the Physical World: Embodied Intelligence Application Technology Innovation Forum Successfully Held in Shenzhen

On October 14, the Shenzhen Robotics Association and the Shenzhen Semiconductor and Integrated Circuit Industry Alliance hosted the Embodied Intelligence Application Technology Innovation Forum in Shenzhen, with China Electronics Port XinChacha as co-organizer. UBTech shared the industrial practices of Walker S2 and its "brain-cerebellum" layered architecture; Huayan Robotics presented a high-precision XYZ linear motor platform with ±0.05μm repeat positioning accuracy; and AMD, Huacheng Industrial Control, Molex, and Sanwei Xin'an discussed computing power, motion control, connectors, and security chips.