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HuiXi Intelligent's cumulative equity financing in 2026 exceeds 2.5 billion yuan

HuiXi Intelligent, an embodied intelligence high-compute chip company, announced that with the successive completion of its Pre-B+ and B rounds, its cumulative equity financing in 2026 has exceeded 2.5 billion yuan. This round was led by the Beijing Artificial Intelligence Industry Investment Fund, with participation from several government funds and market-oriented institutions including the Beijing Robotics Industry Development Investment Fund, Hidden Hill Capital, and Loyal Valley Capital, while existing shareholders such as Shunwei Capital, Source Code Capital, and SenseTime Guoxiang Capital continued to increase their investment. The funds will be focused on R&D of next-generation embodied intelligence high-compute chips, and on accelerating large-scale delivery and industrial ecosystem development.

Part of the event: Huixi Intelligence's cumulative equity financing exceeds 2.5 billion yuan this year

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