Registration Opens for Embodied Intelligence Application Technology Innovation Forum

The Shenzhen Robotics Association and the Wafer Expo are co-hosting the "Bringing AI into the Physical World — Embodied Intelligence Application Technology Innovation Forum" on October 14 at the Shenzhen Convention and Exhibition Center (Futian). Registration is open to companies across complete robot bodies, core components, computing chips, real-time control, and the supply chain ecosystem. The Shenzhen Robotics Association (SRA) was founded in September 2009 by the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences. It now has more than 900 members, whose combined output value exceeds 200 billion yuan.