Dema Technology plans to raise 700 million yuan to build an embodied intelligence system R&D center

Dema Technology announced a plan to issue convertible bonds to raise no more than 701.515 million yuan, to be used for five directions including expanding core components for intelligent logistics equipment and building an intelligent logistics equipment and embodied intelligence system R&D center. Of this, 230.7756 million yuan is planned for the embodied intelligence system R&D center, about one-third of the total fundraising, to carry out full-stack technology R&D for embodied intelligence robots aimed at the logistics industry, and to concurrently develop new logistics equipment products such as the M-series ultra-many-compartment sorting system and the V-Bot vertical two-way vehicle.