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Alibaba Cloud launches E-HPC agent platform

1 reports · 1 sources

Alibaba Cloud launched the E-HPC agent platform, which adopts a four-layer architecture and uses a unified computing network to simultaneously carry HPC, AI training and inference, and agent tasks, and provides three dedicated solutions for chip design, AI4S and life sciences, and embodied intelligence. For embodied intelligence, its RoboAgent connects the entire chain from device-side collection, annotation, and training/inference to simulation deployment; HPDA Robotics has a built-in APAK acceleration engine, and Alibaba Cloud claims that the cost-effectiveness of multimodal data processing can be improved by 2.1 to 5 times. Alibaba Cloud also claims that a leading company in the embodied field has used this solution to complete a closed loop from real-machine collection to algorithm training such as QwenVL. For chip design, E-HPC hybrid cloud can connect to enterprises' existing LSF, Slurm, and PBS scheduling environments, with unified scheduling on and off the cloud and automatic scaling by queue; for AI4S and life sciences, the platform pre-integrates software such as AlphaFold3, OpenFold3, RFDiffusion, GROMACS, and GATK, and customers' own research agents can call elastic computing power through CLI, API, or Skill.

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  1. How Alibaba Cloud E-HPC Supports Scientific Research Agents Through Supercomputing-Intelligence Integration: ToB Industry Observation

    Alibaba Cloud is advancing supercomputing-intelligence integration through its E-HPC platform, using a unified computing network to simultaneously carry HPC, AI training and inference, and agent tasks, and has launched a four-layer E-HPC agent platform. Its RoboAgent connects the embodied intelligence chain from device-side collection, annotation, and training/inference to simulation deployment; HPDA Robotics includes the built-in APAK acceleration engine and claims that multimodal data processing cost-effectiveness can improve by 2.1 to 5 times. E-HPC has also formed three dedicated solutions for chip design, AI4S and life sciences, and embodied intelligence.

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