Elite Robot × Shanghai Xijia: 8-inch SiC substrate laser lift-off + thinning fully automated line achieves 99.5% yield and over 30% efficiency gain

Elite Robot and Shanghai Xijia Semiconductor jointly implemented an 8-inch silicon carbide substrate laser lift-off + thinning fully automated production line. The laser unit processes a single wafer in 20–25 minutes, with yield above 99.5%. A composite robot plus automation system handles autonomous wafer transfer and high-precision alignment; combined with laser modification and ultrasonic lift-off processes, it raises overall production efficiency by more than 30%. The solution uses chained automation to eliminate material transfer and positioning losses between process steps, and applies intelligent scheduling to unify process parameters and ensure line-wide consistency.