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Xinming Showcases Spatial Intelligence Chip Solution at ROSCon China 2026
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At ROSCon China 2026, held in Shanghai from October 16 to 18, Xinming gave a keynote speech in which Vice President Dr. Zhou Fan introduced its spatial intelligence chip and 3D vision AI module. The self-developed chip integrates real-time 3D stereo vision perception, on-device AI and SLAM on a single chip, provides approximately 3.5 TOPS of on-device compute, consumes less than 1W of power, has an approximately 1 millisecond motion-to-display latency, supports 6 cameras and multi-sensor fusion, and does not occupy the host's GPU or NPU compute; the exposed optical portion of the complete module measures less than 10mm×10mm.
Report timeline
- Xinming Shares Spatial Intelligence Chip and 3D Vision AI Module Solution at ROSCon China 2026
Xinming gave a keynote at ROSCon China 2026, where Vice President Dr. Zhou Fan presented its spatial intelligence chip and 3D vision AI module. The self-developed chip integrates real-time 3D stereo vision perception, on-device AI, and SLAM on a single chip, delivering about 3.5 TOPS of on-device compute at under 1 W power consumption, with roughly 1 ms motion-to-display latency, and supports 6 cameras and multi-sensor fusion.
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