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Xinming Shares Spatial Intelligence Chip and 3D Vision AI Module Solution at ROSCon China 2026

Xinming gave a keynote at ROSCon China 2026, where Vice President Dr. Zhou Fan presented its spatial intelligence chip and 3D vision AI module. The self-developed chip integrates real-time 3D stereo vision perception, on-device AI, and SLAM on a single chip, delivering about 3.5 TOPS of on-device compute at under 1 W power consumption, with roughly 1 ms motion-to-display latency, and supports 6 cameras and multi-sensor fusion.

Part of the event: Xinming Showcases Spatial Intelligence Chip Solution at ROSCon China 2026

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